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ADL5562

3.3 GHz Ultralow Distortion RF/IF Differential Amplifier

Analog Devices 

Data Sheet

OUTLINE DIMENSIONS

ADL5562

PIN 1

INDICATOR

0.80

0.75

0.70

SEATING

PLANE

3.10

3.00 SQ

2.90

TOP VIEW

SIDE VIEW

0.50

BSC

0.30

0.23

0.18

13

12

DETAIL A

(JEDEC 95)

16

1

PIN 1

INDICATOR AREA OPTIONS

(SEE DETAIL A)

EXPOSED

PAD

1.75

1.60 SQ

1.45

9

4

0.50

0.40

0.30

8

5

BOTTOM VIEW

0.20 MIN

0.05 MAX

0.02 NOM

COPLANARITY

0.08

0.20 REF

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

COMPLIANT TO JEDEC STANDARDS MO-220-WEED-6.

Figure 48. 16-Lead Lead Frame Chip Scale Package [LFCSP]

3 mm × 3 mm Body and 0.75 mm Package Height

(CP-16-22)

Dimensions shown in millimeters

ORDERING GUIDE

Model1

Temperature

Range

ADL5562ACPZ-R7 −40°C to +85°C

ADL5562ACPZ-WP −40°C to +85°C

ADL5562-EVALZ

1 Z = RoHS Compliant Part.

Package Description

16-Lead Lead Frame Chip Scale Package [LFCSP], 7” Tape and Reel

16-Lead Lead Frame Chip Scale Package [LFCSP], Waffle Pack

Evaluation Board

Package

Option

CP-16-22

CP-16-22

Branding

Q1Q

Q1Q

Ordering

Quantity

1,500

50

©2009–2017 Analog Devices, Inc. All rights reserved. Trademarks and

registered trademarks are the property of their respective owners.

D08003-0-9/17(F)

Rev. F | Page 21 of 21

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