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AM29DL800BB120ECB

8 Megabit (1 M x 8-Bit/512 K x 16-Bit) CMOS 3.0 Volt-only, Simultaneous Operation Flash Memory

Advanced Micro Devices 

PRELIMINARY

sectors of memory), the system must drive WE# and

CE# to VIL, and OE# to VIH.

For program operations, the BYTE# pin determines whether

the device accepts program data in bytes or words. Refer to

“Word/Byte Configuration” for more information.

The device features an Unlock Bypass mode to facili-

tate faster programming. Once a bank enters the Unlock

Bypass mode, only two write cycles are required to pro-

gram a word or byte, instead of four. The “Byte/Word

Program Command Sequence” section has details on

programming data to the device using both standard and

Unlock Bypass command sequences.

An erase operation can erase one sector, multiple sec-

tors, or the entire device. Tables 2 and 3 indicate the

address space that each sector occupies. The device

address space is divided into two banks: Bank 1 con-

tains the boot/parameter sectors, and Bank 2 contains

the larger, code sectors of uniform size. A “bank ad-

dress” is the address bits required to uniquely select a

bank. Similarly, a “sector address” is the address bits

required to uniquely select a sector.

If the system writes the autoselect command se-

quence, the device enters the autoselect mode. The

system can then read autoselect codes from the inter-

nal register (which is separate from the memory array)

on DQ7–DQ0. Standard read cycle timings apply in this

mode. Refer to the Autoselect Mode and Autoselect

Command Sequence sections for more information.

ICC2 in the DC Characteristics table represents the ac-

tive current specification for the write mode. The AC

Characteristics section contains timing specification ta-

bles and timing diagrams for write operations.

Simultaneous Read/Write Operations with

Zero Latency

This device is capable of reading data from one bank of

memory while programming or erasing in the other

bank of memory. An erase operation may also be sus-

pended to read from or program to another location

within the same bank (except the sector being erased).

Figure 19 shows how read and write cycles may be in-

itiated for simultaneous operation with zero latency.

ICC6 and ICC7 in the DC Characteristics table represent

the current specifications for read-while-program and

read-while-erase, respectively.

Standby Mode

When the system is not reading or writing to the device,

it can place the device in the standby mode. In this

mode, current consumption is greatly reduced, and the

outputs are placed in the high impedance state, inde-

pendent of the OE# input.

The device enters the CMOS standby mode when the

CE# and RESET# pins are both held at VCC ± 0.3 V.

(Note that this is a more restricted voltage range than

VIH.) If CE# and RESET# are held at VIH, but not within

VCC ± 0.3 V, the device will be in the standby mode, but

the standby current will be greater. The device requires

standard access time (tCE) for read access when the

device is in either of these standby modes, before it is

ready to read data.

If the device is deselected during erasure or program-

ming, the device draws active current until the

operation is completed.

ICC3 in the DC Characteristics table represents the

standby current specification.

Automatic Sleep Mode

The automatic sleep mode minimizes Flash device

energy consumption. The device automatically enables

this mode when addresses remain stable for tACC + 30

ns. The automatic sleep mode is independent of the

CE#, WE#, and OE# control signals. Standard address

access timings provide new data when addresses are

changed. While in sleep mode, output data is latched

and always available to the system. ICC4 in the DC

Characteristics table represents the automatic sleep

mode current specification.

Am29DL800B

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