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BAS116H

75 V, low leakage diode in small SOD123F package

Philips Electronics 

Philips Semiconductors

9. Package outline

BAS116H

75 V, low leakage diode in small SOD123F package

3.6 2.7

3.4 2.5

1.7

1.5

1

1.2

1.0

0.55

0.35

Dimensions in mm

Fig 6. Package outline SOD123F

2

0.70

0.55

10. Packing information

Table 8: Packing methods

The -xxx numbers are the last three digits of the 12NC ordering code. [1]

Type number Package Description

BAS116H

SO123F

4 mm pitch, 8 mm tape and reel

[1] For further information and the availability of packing methods, see Section 16.

11. Soldering

0.25

0.10

04-11-29

Packing quantity

3 000

10 000

-115

-135

4.4

4

2.9

1.6

2.1 1.6

1.1 1.2

1.1

(2×)

Reflow soldering is the only recommended soldering method.

Dimensions in mm

Fig 7. Reflow soldering footprint SOD123F

solder lands

solder resist

solder paste

occupied area

9397 750 14881

Product data sheet

Rev. 01 — 11 April 2005

© Koninklijke Philips Electronics N.V. 2005. All rights reserved.

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