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BS616LV2017 Ver la hoja de datos (PDF) - Brilliance Semiconductor

Número de pieza
componentes Descripción
Lista de partido
BS616LV2017
BSI
Brilliance Semiconductor BSI
BS616LV2017 Datasheet PDF : 9 Pages
1 2 3 4 5 6 7 8 9
BSI
„ ORDERING INFORMATION
BS616LV2017 X X Z Y Y
BS616LV2017
SPEED
55: 55ns
70: 70ns
PKG MATERIAL
-: Normal
G: Green
P: Pb free
GRADE
C: +0oC ~ +70oC
I: -40oC ~ +85oC
PACKAGE
E: TSOP2-44
A: BGA-48-0608
D: DICE
Note:
BSI (Brilliance Semiconductor Inc.) assumes no responsibility for the application or use of any product or circuit described herein. BSI does not authorize its products
for use as critical components in any application in which the failure of the BSI product may be expected to result in significant injury or death, including life-support
systems and critical medical instruments.
„ PACKAGE DIMENSIONS
NOTES:
1: CONTROLLING DIMENSIONS ARE IN MILLIMETERS.
2: PIN#1 DOT MARKING BY LASER OR PAD PRINT.
3: SYMBOL "N" IS THE NUMBER OF SOLDER BALLS.
BALL PITCH e = 0.75
D
E
N
D1
E1
8.0
6.0
48
5.25
3.75
D1
VIEW A
48 mini-BGA (6 x 8)
R0201-BS616LV2017
8
Revision 1.1
Jan. 2004

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