CX5000 Ver la hoja de datos (PDF) - Unspecified
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CX5000 Datasheet PDF : 6 Pages
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CX5000:
0.18um Structured ASIC Product Family
I/O STANDARD
LVTTL25/33
LVCMOS25/33
PCI
PCI-X
USB
LVDS
LVPECL
SSTL2/3
HSTL
RSDS
VDD
2.5V/3.3V
2.5V/3.3V
3.3V
3.3V
3.3V
3.3V
3.3V
2.5V/3.3V
1.5V
TABLE 4: CX5000 SUPPORTED I/O
NOTES
Selectable drive strength, pull-up/down, slew-rate, hysteresis, Bidir
Selectable drive strength, pull-up/down, slew-rate, hysteresis, Bidir
PCI Standard 2.2 at up to 66MHz
PCI-X standard at up to 133MHz
USB Standard 1.1 at 4Mbps and 12Mbps
IEEE 1596.3-1996, ANSI/TIA/EIA-644-1995
Support for Class I and II
Support for Class I, II and IV
RSDS V1.0
Electrical Specifications
ABSOLUTE MAXIMUM RATINGS
SYMBOL
PARAMETER
MIN
MAX
UNITS
VDDCore
Core Supply Voltage
-0.25
2.25
V
VDDI/O
I/O Supply Voltage
-0.25
4.0
V
Vin/Vout
DC Input and Output
-0.25
4.0
V
TJ
Junction Temperature
-55
155
°C
NORMAL OPERATING CONDITIONS
SYMBOL
PARAMETER
VDD1.8v
Core and I/O Supply Voltage
VDD 2.5v
I/O Supply Voltage
VDD 3.3v
I/O Supply Voltage
MIN
1.5
2.25
3.0
MAX
1.98
2.75
3.6
UNITS
V
V
V
Design Flow
ChipX spends considerable development effort to ensure that taping out a design to a CX5000 Structured
ASIC is a simple, painless, and risk-free endeavor. ChipX provides on-line downloadable libraries for both
Synopsys and Synplify ASIC synthesis tools.
RTL or Netlist Handoff
Many customers prefer to handoff their RTL designs early and let ChipX perform the entire timing closure
loop, including synthesis and final simulations. ChipX can also convert obsolete design netlists and even
well specified concept designs into prototypes rapidly and reliably.
Packaging and Test
ChipX uses world-class external packaging and test facilities in the United States and Taiwan to
assemble and complete commercial, industrial, or military testing and qualification of products. A vast
standard packaging library that includes the most popular DIP, QFP, BGA, fine-pitch BGA, and PGA
package sizes supports the CX5000 product line. The CX5000 is guaranteed to match any standard
FPGA device with a pin-for-pin replacement package. For specialist applications, multi-chip modules or
hard-to-find hermetic or BGA package sizes, ChipX experienced custom package design staff can create
a package or pinout to your specifications. ChipX offers SCAN insertion and ATPG as well as fault
grading, at speed test, Mil 883 test flows and a variety of additional test and QA services to match every
product requirement.
© ChipX Inc.
For more information, please visit our website: www.chipx.com
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CEC034 (9/20/05)
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