FAN5308 Ver la hoja de datos (PDF) - Fairchild Semiconductor
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FAN5308 Datasheet PDF : 11 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only.
Parameter
VIN
Voltage On Any Other Pin
Lead Soldering Temperature (10 seconds)
Junction Temperature
Storage Temperature
Thermal Resistance, Junction-to-Case (θJC), 3x3mm 6-lead MLP(1)
Electrostatic Discharge Protection (ESD) Level(2)
HBM
CDM
Min.
-0.3
-0.3
-65
4
1
Max.
7.0
VIN
260
150
150
8
Unit
V
V
°C
°C
°C
°C/W
kV
Notes:
1. Junction-to-ambient thermal resistance, θJA, is a strong function of PCB material, board thickness, thickness and
number of copper planes, number of via used, diameter of via used, available copper surface, and attached heat sink
characteristics.
2. Using Mil Std. 883E, method 3015.7 (Human Body Model) and EIA/JESD22C101-A (Charged Device Model).
Recommended Operating Conditions
The Recommended Operating Conditions table defines the conditions for actual device operation. Recommended
operating conditions are specified to ensure optimal performance to the datasheet specifications. Fairchild does not
recommend exceeding them or designing to absolute maximum ratings.
Parameter
Supply Voltage Range
Output Voltage Range, Adjustable Version
Output Current
Inductor(3)
Input Capacitor(3)
Output Capacitor(3)
Operating Ambient Temperature Range
Operating Junction Temperature Range
Min.
2.5
0.8
-40
-40
Typ.
3.3
10
2 x 10
Max.
5.5
VIN
800
+85
+125
Unit
V
V
mA
µH
µF
µF
°C
°C
Note:
3. Refer to the Applications section for details.
© 2005 Fairchild Semiconductor Corporation
FAN5308 Rev. 1.0.2
3
www.fairchildsemi.com
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