FSL116LR Ver la hoja de datos (PDF) - Fairchild Semiconductor
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FSL116LR Datasheet PDF : 13 Pages
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Absolute Maximum Ratings
Stresses exceeding the absolute maximum ratings may damage the device. The device may not function or be
operable above the recommended operating conditions and stressing the parts to these levels is not recommended.
In addition, extended exposure to stresses above the recommended operating conditions may affect device reliability.
The absolute maximum ratings are stress ratings only. TJ = 25°C, unless otherwise specified.
Symbol
Parameter
Min.
Max.
Unit
VSTR
VDS
VCC
VFB
ID
IDM
EAS
PD
TJ
TA
TSTG
ESD
ΘJA
ΘJC
ΘJT
VSTR Pin Voltage
Drain Pin Voltage
Supply Voltage
Feedback Voltage Range
Continuous Drain Current
Drain Current Pulsed(4)
Single Pulsed Avalanche Energy(5)
Total Power Dissipation
Operating Junction Temperature
Operating Ambient Temperature
Storage Temperature
Human Body Model, JESD22-A114(6)
Charged Device Model, JESD22-C101(6)
Junction-to-Ambient Thermal Resistance(7,8)
Junction-to-Case Thermal Resistance(7,9)
Junction-to-Top Thermal Resistance(7,10)
-0.3
650.0
-0.3
650.0
26
-0.3
12.0
1
4
38
1.5
Internally Limited
-40
+105
-55
+150
5
2
80
19
33.7
V
V
V
V
A
A
mJ
W
°C
°C
°C
KV
°C/W
°C/W
°C/W
Notes:
4. Repetitive rating: pulse width limited by maximum junction temperature.
5. L=30mH, starting TJ=25°C.
6. Meets JEDEC standards JESD 22-A114 and JESD 22-C101.
7. All items are tested with the standards JESD 51-2 and JESD 51-10.
8. ΘJA free-standing, with no heat-sink, under natural convection.
9. ΘJC junction-to-lead thermal characteristics under ΘJA test condition. TC is measured on the source #7 pin closed
to plastic interface for ΘJA thermo-couple mounted on soldering.
10. ΘJT junction-to-top of thermal characteristic under ΘJA test condition. Tt is measured on top of package. Thermo-
couple is mounted in epoxy glue.
© 2010 Fairchild Semiconductor Corporation
FSL116LR • Rev. 1.0.1
4
www.fairchildsemi.com
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