HFA3763 Ver la hoja de datos (PDF) - Intersil
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HFA3763 Datasheet PDF : 10 Pages
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HFA3763
Thin Plastic Quad Flatpack Packages (LQFP)
D
D1
-D-
-A-
-B-
E E1
PIN 1
-H-
GAGE
PLANE
0.020
0.008 MIN
0o MIN
L
0o-7o
0.25
0.010
e
SEATING
A PLANE
0.08
0.003
-C-
11o-13o
0.13
0.005
M
C
A-B S
DS
b
b1
0.09/0.16
A2 A1 0.004/0.006
11o-13o
BASE METAL
WITH PLATING
0.09/0.20
0.004/0.008
Q80.14x14 (JEDEC MS-026BEC ISSUE C)
80 LEAD THIN PLASTIC QUAD FLATPACK PACKAGE
SYM-
BOL
INCHES
MIN
MAX
MILLIMETERS
MIN
MAX
NOTES
A
-
0.062
-
1.60
-
A1
0.002 0.005 0.05
0.15
-
A2
0.054 0.057 1.35
1.45
-
b
0.009 0.014 0.22
0.38
6
b1
0.009 0.012 0.22
0.33
-
D
0.626 0.634 15.90 16.10
3
D1
0.547 0.555 13.90 14.10
4, 5
E
0.626 0.634 15.90 16.10
3
E1
0.547 0.555 13.90 14.10
4, 5
L
0.018 0.029 0.45
0.75
-
N
80
80
7
e
0.026 BSC
0.65 BSC
-
NOTES:
Rev. 2 4/99
1. Controlling dimension: MILLIMETER. Converted inch
dimensions are not necessarily exact.
2. All dimensions and tolerances per ANSI Y14.5M-1982.
3. Dimensions D and E to be determined at seating plane -C- .
4. Dimensions D1 and E1 to be determined at datum plane
-H- .
5. Dimensions D1 and E1 do not include mold protrusion.
Allowable protrusion is 0.25mm (0.010 inch) per side.
6. Dimension b does not include dambar protrusion. Allowable
dambar protrusion shall not cause the lead width to exceed
the maximum b dimension by more than 0.08mm (0.003 inch).
7. “N” is the number of terminal positions.
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Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time with-
out notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
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