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LAN91C111I-NC

10/100 Non-PCI Ethernet Single Chip MAC + PHY

SMSC -> Microchip 

Chapter 15 Package Outlines

10/100 Non-PCI Ethernet Single Chip MAC + PHY

Datasheet

Figure 15.1 128 Pin TQFP Package Outline, 14X14X1.0 Body

Table 15.1 128 Pin TQFP Package Parameters

MIN

NOMINAL

MAX

REMARK

A

~

~

A1

0.05

~

A2

0.95

1.00

D

15.80

16.00

D/2

7.90

8.00

D1

13.80

14.00

E

15.80

16.00

E/2

7.90

8.00

E1

13.80

14.00

H

0.09

~

L

0.45

0.60

L1

~

1.00

e

0.40 Basic

q

0o

~

W

0.13

0.18

R1

0.08

~

R2

0.08

~

ccc

~

~

ccc

~

~

1.20

0.15

1.05

16.20

8.10

14.20

16.20

8.10

14.20

0.20

0.75

~

7o

0.23

~

0.20

0.0762

0.08

Overall Package Height

Standoff

Body Thickness

X Span

1/2 X Span Measure from Centerline

X body Size

Y Span

1/2 Y Span Measure from Centerline

Y body Size

Lead Frame Thickness

Lead Foot Length from Centerline

Lead Length

Lead Pitch

Lead Foot Angle

Lead Width

Lead Shoulder Radius

Lead Foot Radius

Coplanarity (Assemblers)

Coplanarity (Test House)

Notes:

1. Controlling Unit: millimeter

2. Tolerance on the position of the leads is ± 0.035 mm maximum

3. Package body dimensions D1 and E1 do not include the mold protrusion.

Maximum mold protrusion is 0.25 mm

4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane is 0.78-1.08 mm.

5. Details of pin 1 identifier are optional but must be located within the zone indicated.

6. Shoulder widths must conform to JEDEC MS-026 dimension 'S' of a minimum of 0.20mm.

Revision 1.91 (08-18-08)

126

SMSC LAN91C111 REV C

DATASHEET

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