LPC47N237 Ver la hoja de datos (PDF) - SMSC -> Microchip
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LPC47N237 Datasheet PDF : 5 Pages
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Package Outline
Figure 2 – 100 Pin TQFP Package Outline
Table 1 – 100 Pin TQFP Package Parameters
MIN
NOMINAL
MAX
A
~
~
1.60
A1
0.05
~
0.15
A2
1.35
~
1.45
D
15.80
~
16.20
D1
13.90
~
14.10
E
15.80
~
16.20
E1
13.90
~
14.10
H
0.09
~
0.20
L
0.45
0.60
0.75
L1
~
1.00
~
e
0.50 Basic
θ
0o
~
7o
W
0.17
0.22
0.27
R1
0.08
~
~
R2
0.08
~
0.20
ccc
~
~
0.08
REMARKS
Overall Package Height
Standoff
Body Thickness
X Span
X body Size
Y Span
Y body Size
Lead Frame Thickness
Lead Foot Length
Lead Length
Lead Pitch
Lead Foot Angle
Lead Width
Lead Shoulder Radius
Lead Foot Radius
Coplanarity
Notes:
1. Controlling Unit: millimeter.
2. Tolerance on the position of the leads is ± 0.04 mm maximum.
3. Package body dimensions D1 and E1 do not include the mold protrusion. Maximum mold protrusion is 0.25 mm.
4. Dimension for foot length L measured at the gauge plane 0.25 mm above the seating plane.
5. Details of pin 1 identifier are optional but must be located within the zone indicated.
SMSC DB – LPC47N237
Page 5
PRODUCT PREVIEW
Revision 0.3 (03-30-07)
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