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MAX2057
(Rev.:2010)

1300MHz to 2700MHz Variable-Gain Amplifier with Analog Gain Control

Maxim Integrated 

1300MHz to 2700MHz Variable-Gain

Amplifier with Analog Gain Control

Pin Description

PIN

1, 3, 4, 6, 7,

9, 10, 12,

14, 18, 19,

21–24, 27,

28, 30, 31,

33, 34, 36

2

5, 13, 16,

25, 32

8

11

15

17

20

26

29

35

—

NAME

FUNCTION

GND

Ground. Connect to the board’s ground plane using low-inductance layout techniques.

OUT_A

Second-Attenuator Output. Internally matched to 50
over the operating frequency band. Connect

to IN through a DC-blocking capacitor if greater than 21dB of gain-control range is required. No

connection is required if the second attenuator is not used.

VCC

Power Supply. Bypass each pin to GND with capacitors as shown in the Typical Application

Circuit. Place capacitors as close to the pin as possible.

IN_A

Second-Attenuator Input. Internally matched to 50
over the operating frequency band. Connect to

a 50
RF source through a DC-blocking capacitor if greater than 21dB of gain-control range is

required. No connection is required if the second attenuator is not used.

VCNTL

Analog Gain-Control Input. Limit voltages applied to this pin to a 1V to 4.5V range when VCC is

present to ensure device reliability.

RSET1

RSET2

OUT

First-Stage Amplifier Bias-Current Setting. Connect to GND through a 1.2k
resistor.

Second-Stage Amplifier Bias-Current Setting. Connect to GND through a 2k
resistor.

RF Output. Internally matched to 50
over the operating frequency band. Requires a DC-blocking

capacitor and a shunt-matching capacitor.

AMP_IN

Amplifier Input. Internally matched to 50
over the operating frequency band. Connect to

ATTN_OUT through a DC-blocking capacitor.

ATTN _OUT

Attenuator Output. Internally matched to 50
over the operating frequency band. Connect to

AMP_IN through a DC-blocking capacitor.

IN

RF Input. Internally matched to 50
over the operating frequency band. Connect to a 50
RF

source through a DC-blocking capacitor if the second attenuator is not used.

EP

Exposed Pad. This pad affects RF performance and provides heat dissipation. This pad MUST be

soldered evenly to the board’s ground plane for proper operation.

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