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MAX2383

W-CDMA Upconverter and PA Driver with Power Control

Maxim Integrated 

W-CDMA Upconverter and PA Driver

with Power Control

for optimum linearity and return loss. It is important to

tune the interstage matching network components

along with the driver output matching components, to

achieve the desired cascaded ACPR performance from

the whole device.

Layout Issues

For best performance, pay attention to power-supply

issues as well as to the layout of the signal lines. The

EV kit can be used as a layout example. Ground con-

nections followed by supply bypass are the most

important.

Power-Supply and SHDN Bypassing

Bypass VCC with a 330pF capacitor to GND as close as

possible to the VCC pin. Use separate vias to the

ground plane for each of the bypass capacitors and

minimize trace length to reduce inductance. Use three

separate vias to the ground plane for each ground pin.

Power-Supply Layout

To minimize coupling between different sections of the

IC, the ideal power-supply layout is a star configuration

with a large decoupling capacitor at a central VCC

node. The VCC traces branch out from this central

node, each going to a separate VCC node in the PC

board. At the end of each trace is a bypass capacitor

that has low ESR at the RF frequency of operation. This

arrangement provides local decoupling at each VCC

pin. At high frequencies, any signal leaking out of one

supply pin sees a relatively high impedance (formed by

the VCC trace inductance) to the central VCC node, and

an even higher impedance to any other supply pin, as

well as a low impedance to ground through the bypass

capacitor.

Impedance-Matching Network Layout

The DROUT and interstage matching networks are very

sensitive to layout-related parasitic. To minimize para-

sitic inductance, keep all traces short and place com-

ponents as close as possible to the chip. To minimize

parasitic capacitance, minimize the area of the plane.

TOP VIEW

Pin Configuration

A

LO+ /

VCC

DROUT

GND

LO_EN

B

LO- /

SHDN

MAX2383

GC

DRIN

C

IFIN-

1

IFIN+

RFOUT

GND

2

3

4

UCSP Reliability

The chip-scale package (UCSP) represents a unique

package that greatly reduces board space compared

to other packages. UCSP reliability is integrally linked

to the user’s assembly methods, circuit board material,

and usage environment. The user should closely review

these areas when considering use of a UCSP. This form

factor may not perform equally to a packaged product

through traditional mechanical reliability tests.

Performance through Operating Life Test and Moisture

Resistance remains uncompromised as it is primarily

determined by the wafer-fabrication process.

Mechanical stress performance is a greater considera-

tion for a UCSP. UCSP solder joint contact integrity

must be considered since the package is attached

through direct solder contact to the user’s PC board.

Testing done to characterize the UCSP reliability perfor-

mance shows that it is capable of performing reliably

through environmental stresses. Results of environmen-

tal stress tests and additional usage data and recom-

mendations are detailed in the UCSP application note,

which can be found on Maxim’s website, www.maxim-ic.com.

Chip Information

TRANSISTOR COUNT: 998

6 _______________________________________________________________________________________

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