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NCP1606

Cost Effective Power Factor Controller

ON Semiconductor 

NCP1606

PIN FUNCTION DESCRIPTION

Pin Number

Name

Function

1

Feedback (FB) The FB pin makes available the inverting input of the internal error amplifier. A simple resistor divider

scales and delivers the output voltage to the FB pin to maintain regulation. The feedback information

is also used for the programmable overvoltage and undervoltage protections.

2

Control

The regulation block output is available on this pin. A compensation network is placed between FB

and Control to set the loop bandwidth low enough to yield a high power factor ratio and a low THD.

3

Ct

The Ct pin sources a 270 mA current to charge an external timing capacitor. The circuit controls the power

switch on time by comparing the Ct voltage to an internal voltage derived from the regulation block.

4

Current Sense This pin limits the pulse by pulse current through the switch MOSFET when connected as show in

(CS)

Figure 1. When the voltage exceeds 1.7 V (A version) or 0.5 V (B version), the drive turns off. The

maximum switch current can be adjusted by changing the sense resistor.

5

Zero Current The voltage of an auxiliary winding should be applied to this pin to detect the moment when the coil is

Detection (ZCD) demagnetized for critical conduction mode operation. Ground ZCD to shutdown the part.

6

Ground (GND) Connect this pin to the pre−converter ground.

7

Drive (DRV)

The powerful integrated driver is suitable to effectively switch a high gate charge power MOSFET.

8

VCC

This pin is the positive supply of the IC. The circuit starts to operate when VCC exceeds 12 V (typ)

and turns off when VCC goes below 9.5 V (typ). After startup, the operating range is 10.3 V to 20 V.

MAXIMUM RATINGS

Pin

Rating

Symbol

Value

Unit

7

Output Drive Capability

IDRV(source)

+500

mA

IDRV(sink)

−800

mA

7

Maximum DRV Pin Voltage

VDRV

−0.3, +20

V

8

Power Supply Input

VCC

−0.3, +20

V

1, 2, 3, 4, 5 Input Voltage

VIN

−0.3, +9

V

Power Dissipation and Thermal Characteristics

P suffix, Plastic Package, Case 626

Maximum Power Dissipation @ TA = 70°C

Thermal Resistance Junction−to−Air

D suffix, Plastic Package, Case 751

Maximum Power Dissipation @ TA = 70°C

Thermal Resistance Junction−to−Air

PD(DIP)

800

RqJA(DIP)

100

PD(SO)

450

RqJA(SO)

178

mW

°C/W

mW

°C/W

Operating Junction Temperature Range

TJ

−25 to +125

°C

Maximum Junction Temperature

TJmax

150

°C

Storage Temperature Range

TSmax

−65 to 150

°C

Lead Temperature (Soldering, 10 s)

TLmax

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Pins 1−8 (except pin 7): Human Body Model 2000 V per Mil−Std−883, Method 3015. Machine Model Method 200 V

Pin 7: Human Body Model 2000 V per Mil−Std−883, Method 3015. Machine Model Method 170 V

2. This device contains latch−up protection and exceeds 100 mA per JEDEC Standard JESD78.

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