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NCP1607

Cost Effective Power Factor Controller

ON Semiconductor 

NCP1607

PIN FUNCTION DESCRIPTION

Pin Name

Function

1

FB The FB pin is the inverting input of the internal error amplifier. An external resistor divider scales the output voltage to the

internal reference voltage to maintain regulation. The feedback information is also used for the programmable overvoltage

and undervoltage protections. The controller is disabled when this pin is below the undervoltage protection threshold,

VUVP, typically 0.3 V.

2 Control The Control pin is the output of the internal error amplifier. A compensation network is placed between the Control and FB

pins to set the loop bandwidth. A low enough bandwidth is needed to obtain a high power factor ratio and a low THD.

3

Ct The Ct pin sources a current to charge an external timing capacitor. The circuit controls the power switch on time by com-

paring the Ct voltage to an internal voltage derived from the regulation block. The Ct pin discharges the external timing

capacitor at the end of the switching cycle.

4

CS The CS pin limits the cycle−by−cycle current through the power switch. When the CS voltage exceeds the internal

threshold, the MOSFET driver turns off. The sense resistor that connects to the CS pin programs the maximum switch

current.

5 ZCD The voltage of an auxiliary winding is applied to this pin to detect when the inductor is demagnetized for critical conduction

mode operation. The controller is disabled when this pin is grounded.

6 GND Analog ground.

7 DRV Integrated MOSFET driver capable of driving a high gate charge power MOSFET.

8

VCC The VCC pin is the positive supply of the controller. The controller is enabled when VCC exceeds VCC(on) and remains

enabled until VCC decreases below VCC(off).

MAXIMUM RATINGS

Rating

Symbol

Value

Unit

Supply Voltage

VCC

−0.3 to 20

V

Supply Current

ICC

±20

mA

DRV Voltage

VDRV

−0.3 to 20

V

DRV Sink Current

IDRV(sink)

800

mA

DRV Source Current

IDRV(source)

500

mA

FB Voltage

VFB

−0.3 to 10

V

FB Current

IFB

±10

mA

Control Voltage

VCONTROL

−0.3 to 10

V

Control Current

ICONTROL

−2 to 10

mA

Ct Voltage

VCt

−0.3 to 6

V

Ct Current

ICt

±10

mA

CS Voltage

VCS

−0.3 to 6

V

CS Current

ICS

±10

mA

ZCD Voltage

VZCD

−0.3 to 10

V

ZCD Current

IZCD

±10

mA

Power Dissipation and Thermal Characteristics

D suffix, Plastic Package, Case 751

Maximum Power Dissipation @ TA = 70°C

Thermal Resistance Junction−to−Air

PD(SO)

450

mW

RqJA(SO)

178

°C/W

Operating Junction Temperature Range

TJ

−40 to 125

°C

Maximum Junction Temperature

TJ(MAX)

150

°C

Storage Temperature Range

TSTG

−65 to 150

°C

Lead Temperature (Soldering, 10 s)

TL

300

°C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

1. This device series contains ESD protection and exceeds the following tests:

Pins 1−6, 8: Human Body Model 2000 V per JEDEC Standard JESD22−A114E,

Machine Model Method 200 V per JEDEC Standard JESD22−A115−A

Pin 7: Human Body Model 2000 V per JEDEC Standard JESD22−A114E,

Machine Model Method 180 V per JEDEC Standard JESD22−A115−A

2. This device contains latch−up protection and exceeds ±100 mA per JEDEC Standard JESD78.

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