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P4C168 Ver la hoja de datos (PDF) - Semiconductor Corporation

Número de pieza
componentes Descripción
Lista de partido
P4C168
PYRAMID
Semiconductor Corporation PYRAMID
P4C168 Datasheet PDF : 15 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
P4C168, P4C169, P4C170
ORDERING INFORMATION
SELECTION GUIDE
The P4C168, P4C169 and P4C170 are available in the following temperature, speed and package options.
Temperature
Range
Package
Speed
12
15
20
25
35
Commercial
Temperature
Plastic DIP
Plastic SOIC†
Plastic SOJ††
-12PC
-15PC
-20PC
-25PC
N/A
-12SC
-15SC
-20SC
-25SC
N/A
-12JC
-15JC
-20JC
-25JC
N/A
LCC
N/A
-15LM
-20LM
-25LM
-35LM
Military
Temperature
(P4C168 only)
CERDIP
Side Brazed DIP
CERPACK
N/A
-15DM
-20DM
-25DM
-35DM
N/A
-15CM
-20CM
-25CM
-35CM
N/A
-15FM
-20FM
-25FM
-35FM
Solder Seal Flat Pack
N/A
-15FSM -20FSM -25FSM -35FSM
LCC
N/A
-15LMB -20LMB -25LMB -35LMB
Military
Processed*
(P4C168 only)
CERDIP
Side Brazed DIP
CERPACK
N/A
-15DMB -20DMB -25DMB -35DMB
N/A
-15CMB -20CMB -25CMB -35CMB
N/A
-15FMB -20FMB -25FMB -35FMB
Solder Seal Flat Pack
N/A
-15FSMB -20FSMB -25FSMB -35FSMB
† P4C168 and P4C169 only.
†† P4C168
* Military temperature range with MIL-STD-883, Class B processing.
N/A = Not available
Document # SRAM107 REV A
Page 8 of 15

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