datasheetbank_Logo
búsqueda de Hoja de datos y gratuito Fichas de descarga

PCA9561 Ver la hoja de datos (PDF) - NXP Semiconductors.

Número de pieza
componentes Descripción
Lista de partido
PCA9561 Datasheet PDF : 26 Pages
First Prev 21 22 23 24 25 26
NXP Semiconductors
17. Soldering: PCB footprints
PCA9561
Quad 6-bit multiplexed I2C-bus EEPROM DIP switch
Footprint information for reflow soldering of TSSOP20 package
SOT360-1
Hx
Gx
P2
(0.125)
(0.125)
Hy Gy
C
D2 (4x)
P1
D1
Generic footprint pattern
Refer to the package outline drawing for actual layout
By Ay
solder land
occupied area
DIMENSIONS in mm
P1
P2
Ay
By
C
D1 D2 Gx Gy Hx Hy
0.650 0.750 7.200 4.500 1.350 0.400 0.600 6.900 5.300 7.300 7.450
Fig 17. PCB footprint for SOT360-1 (TSSOP20); reflow soldering
PCA9561
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 4 — 6 November 2012
sot360-1_fr
© NXP B.V. 2012. All rights reserved.
21 of 26

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]