RJP1CS08DWA Ver la hoja de datos (PDF) - Renesas Electronics

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componentes Descripción

Lista de partido

RJP1CS08DWA

1250V - 200A - IGBT Application: Inverter

Renesas Electronics 

RJP1CS08DWT/RJP1CS08DWA

Die Dimension

1.31

8.88

Preliminary

Gate

bonding pad

Emitter bonding pad (1)

Emitter bonding pad (2)

Emitter bonding pad (3)

Emitter bonding pad (4)

10.25

11.9

Unit: mm

Note 1.

Illustration

Part of white

Part of dotted line

Part of gray

Definition

Al pattern

Bonding area

Final passivation

Note 2. The back of the chip is processed with Au evaporation.

Note 3. Recognition, target and any other patterns which are not related to

IGBT operation, may be changed without notice.

Ordering Information

Orderable Part Number

RJP1CS08DWA-80#W0

RJP1CS08DWT-80#X0

R07DS0831EJ0100 Rev.1.00

Jan 23, 2013

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