STPS30170CFP Ver la hoja de datos (PDF) - STMicroelectronics
Número de pieza
componentes Descripción
Lista de partido
STPS30170CFP Datasheet PDF : 9 Pages
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STPS30170C
Figure 13: Thermal resistance junction to
ambient versus copper surface under tab
(Epoxy printed circuit board, copper
thickness: 35 µm) (D2PAK)
Rth(j-a)(°C/W)
80
70
D²PAK
60
50
40
30
20
10
0
0
SCU(cm²)
5
10
15
20
25
30
35
40
Figure 14: TO-247 Package Mechanical Data
V
V
Dia
H
A
L5
L
L2
L4
F1
V2
F2 L1
F3
F4 L3
D
F(x3)
M
E
G
DIMENSIONS
REF. Millimeters
Inches
Min. Typ. Max. Min. Typ. Max.
A 4.85
5.15 0.191
0.203
D 2.20
2.60 0.086
0.102
E 0.40
0.80 0.015
0.031
F 1.00
1.40 0.039
0.055
F1
3.00
0.118
F2
2.00
0.078
F3 2.00
2.40 0.078
0.094
F4 3.00
3.40 0.118
0.133
G
10.90
0.429
H 15.45
15.75 0.608
0.620
L 19.85
20.15 0.781
0.793
L1 3.70
4.30 0.145
0.169
L2
18.50
0.728
L3 14.20
14.80 0.559
0.582
L4
34.60
1.362
L5
5.50
0.216
M 2.00
3.00 0.078
0.118
V
5°
5°
V2
60°
60°
Dia. 3.55
3.65 0.139
0.143
5/9
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