STW51000 Ver la hoja de datos (PDF) - STMicroelectronics

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STW51000

SUPER INTEGRATED DSP ENGINE

STMicroelectronics 

GreenSIDE - STW51000

11 Package Information

Figure 5. PBGA/HSP-569 (40x40x2.46mm) Mechanical Data & Package Dimensions

DIM.

MIN.

mm

TYP. MAX. MIN.

inch

TYP. MAX.

A

2.46

0.097

A1 0.36

0.142

A2

1.73

0.068

b 0.60 0.75 0.90 0.024 0.029 0.035

D 39.80 40.00 40.20 1.567 1.575 1.583

D1

38.10

1.500

D2

34.50

1.358

E 39.80 40.00 40.20 1.567 1.575 1.583

E1

38.10

1.500

E2

34.50

1.358

e

1.27

0.05

F

0.95

0.037

H

27.00

1.062

ddd

0.20

0.008

eee

0.30

0.012

fff

0.15

0.006

OUTLINE AND

MECHANICAL DATA

PBGA/HSp-569 (40x40x2.46mm)

Heat Spreader Plastic Ball Grid Array

B

D

ddd C

D1

F

A

D2

e

BOTTOM VIEW

A

A1

H

(1) - The terminal A1 corner must be identified on the top surface by using a corner chamfer,

ink or metallized markings, or other feature of package body or integral heatslug

- A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner.

- Exact shape of each corner is optional.

A2

C

SEATING

PLANE

6/8

7572866 A

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