CB45000 Ver la hoja de datos (PDF) - STMicroelectronics
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CB45000 Datasheet PDF : 16 Pages
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CB45000 SERIES
PACKAGE AVAILABILITY
The CB45000 Series is designed to be
compatible with QFP, BGA and SBC package
types, in addition to the more traditional types
found.
The options include Plastic Leaded Chip Carriers
(PLCC) up to 84 pins, while the Metric Quad Flat
Pack (xQFP) offering ranges up to 208 pins. Both
high performance and high power variants are
available as well as the TQFP thin types.
Ball Grid Array (BGA) packages are available
from 160 to 500 pins with further developments
planned in the near future. SBC types allow the
pin count to reach the area of 1000 pins.
The diversity in pin count and package style gives
the designer the opportunity to find the best
compromise for system size, cost and
performance requirements.
Figure 6
Packaging Capability
NUMBER
OF LEADS
(Pins)
PQFP
TQFP
20
28
44
r
64
r
r
68
80
r
r
84
100
r
r
120
r
128
r
144
r
r
160
r
176
r
180
208
r
224
225
256
257
304
352
400
480
r Packages in Production
A Packages in Development
PACKAGE NAME
BGA
PLCC
r
r
r
r
r
r
r
A
A
A
®
POWER PQFP
Slug/Spreader
r
r
r
r
r
9/16
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