TGA4508 Ver la hoja de datos (PDF) - TriQuint Semiconductor

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Lista de partido

TGA4508

Ka Band Low Noise Amplifier

TriQuint Semiconductor 

Mechanical Drawing

TGA4508

0.840 (0.033)

0.719 (0.028)

2

0.532 (0.021)

1

3

4

5

0.532 (0.021)

0.000 (0.000)

Units: Millimeters (Inches)

Thickness: 0.100 (0.004)

Chip edge to bond pad dimensions are shown to center of bond pad

Chip size tolerance: +/- 0.051 (0.002)

GND IS BACKSIDE OF MMIC

Bond pad #1

Bond pad #2

Bond pad #3

Bond pad #4

Bond pad #5

(RF In)

(Vg)

(Vd1,2)

(Vd3)

(RF Out)

0.100 x 0.200 (0.004 x 0.008)

0.100 x 0.100 (0.004 x 0.004)

0.100 x 0.100 (0.004 x 0.004)

0.100 x 0.100 (0.004 x 0.004)

0.100 x 0.200 (0.004 x 0.008)

GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should

be observed during handling, assembly and test.

9

TriQuint Semiconductor: www. triquint.com (972)994-8465 Fax (972)994-8504 Info-mmw@tqs.com

May 2009 © Rev -

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