TZA3047B Ver la hoja de datos (PDF) - Philips Electronics
Número de pieza
componentes Descripción
Lista de partido
TZA3047B Datasheet PDF : 28 Pages
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Philips Semiconductors
30 Mbits/s up to 1.25 Gbits/s laser drivers
Product specification
TZA3047A; TZA3047B
SYMBOL
PIN
PAD(1)
DESCRIPTION
GNDO
−
36 ground
LA
21
37 non-inverted laser modulation output (RF output); output for laser
i.c.
−
38 internally connected
LA
−
39 non-inverted laser modulation output (RF output); output for laser
LA
22
40 non-inverted laser modulation output (RF output); output for laser
LA
−
41 non-inverted laser modulation output (RF output); output for laser
GND
23
−
ground
GNDO
−
42 ground
BIAS
24
43 current source output for the laser bias current
VCCO
VCCO
ACDC
25
44 supply voltage for the output stage and the laser diode
−
45 supply voltage for the output stage and the laser diode
−
46 AC or DC coupled laser; note 2
GNDESD
−
47 ground
MON
26
48 input for the monitor photo diode (RF input)
BIASIN
27
49 input for the bias current setting
BIASOUT
28
50 output of the control block for the bias current
GNDCCB
−
51 ground
MODIN
29
52 input for the modulation current setting
GNDCCB
−
53 ground
i.c.
−
54 internally connected
MODOUT
30
55 output of the control block for the modulation current
ER
31
56 input for the optical extinction ratio setting
AVR
32
57 input for the optical average power level setting
Notes
1. All ground pads must be connected to ground.
2. ACDC pad must be left unconnected for AC-coupling applications. For DC-coupling applications, connect this pad to
ground.
2003 Jun 05
6
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