datasheetbank_Logo
búsqueda de Hoja de datos y gratuito Fichas de descarga

AD834S Ver la hoja de datos (PDF) - Analog Devices

Número de pieza
componentes Descripción
Lista de partido
AD834S
ADI
Analog Devices ADI
AD834S Datasheet PDF : 12 Pages
1 2 3 4 5 6 7 8 9 10 Next Last
AD834
ABSOLUTE MAXIMUM RATINGS*
Supply Voltage (+VS to –VS) . . . . . . . . . . . . . . . . . . . . . . 18 V
Internal Power Dissipation . . . . . . . . . . . . . . . . . . . . 500 mW
Input Voltages (X1, X2, Y1, Y2) . . . . . . . . . . . . . . . . . . . +VS
Operating Temperature Range
AD834J . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0C to 70C
AD834A . . . . . . . . . . . . . . . . . . . . . . . . . . . –40C to +85C
AD834S/883B . . . . . . . . . . . . . . . . . . . . . –55C to +125C
Storage Temperature Range (Q) . . . . . . . . . –65C to +150C
Storage Temperature Range (R, N) . . . . . . . –65C to +125C
Lead Temperature (Soldering 60 sec) . . . . . . . . . . . . . 300C
ESD Rating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 V
*Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the devices. This is a stress rating only; functional operation of the
device at these or any other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
THERMAL CHARACTERISTICS
JC
8-Lead Cerdip Package (Q)
30C/W
8-Lead Plastic SOIC (R)
45C/W
8-Lead Plastic Mini-DIP (N) 50C/W
JA
110C/W
165C/W
99C/W
ORDERING GUIDE
Model
Temperature
Range
Package
Option*
AD834JN
AD834JR
AD834JR-REEL
AD834JR-REEL7
AD834AR
AD834AQ
AD834SQ/883B
AD834SCHIPS
0C to 70C
0C to 70C
0C to 70C
0C to 70C
–40C to +85C
–40C to +85C
–55C to +125C
–55C to +125C
N-8
SO-8
SO-8
SO-8
SO-8
Q-8
Q-8
DIE
*N = Plastic DIP; Q = Cerdip; SO = Small Outline IC (SOIC) Package.
CONNECTION DIAGRAM
Small Outline (R) Package
Plastic DIP (N) Package
Cerdip (Q) Package
Y1 1
8 X2
Y2 2 AD834 7 X1
TOP VIEW
–VS 3 (Not to Scale) 6 +VS
W2 4
5 W1
METALIZATION PHOTOGRAPH
CHIP DIMENSIONS AND BONDING DIAGRAM
Dimensions shown in inches and (mm).
Contact factory for latest dimensions.
Y1 1
Y2
2
8 X2
7 X1
0.054 (1.37)
–VS 3
6 +VS
4
5
W2
W1
0.054 (1.37)
–4–
REV. D

Share Link: 

datasheetbank.com [ Privacy Policy ] [ Request Datasheet ] [ Contact Us ]