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ADG786BCP Datasheet PDF : 12 Pages
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ADG786/ADG788
ABSOLUTE MAXIMUM RATINGS1
(TA = 25°C unless otherwise noted)
VDD to VSS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
VSS to GND . . . . . . . . . . . . . . . . . . . . . . . . . . +0.3 V to –3.5 V
Analog Inputs2 . . . . . . . . . . . . . . VSS – 0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Digital Inputs2 . . . . . . . . . . . . . . . . . –0.3 V to VDD + 0.3 V or
30 mA, Whichever Occurs First
Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 100 mA
(Pulsed at 1 ms, 10% Duty Cycle max)
Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . . 30 mA
Operating Temperature Range
Industrial (A, B Versions) . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
20 Lead CSP, θJA Thermal Impedance . . . . . . . . . . . 32°C/W
Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300°C
IR Reflow, Peak Temperature . . . . . . . . . . . . . . . . . . . 220°C
NOTES
1Stresses above those listed under Absolute Maximum Ratings may cause perma-
nent damage to the device. This is a stress rating only; functional operation of the
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. Only one absolute
maximum rating may be applied at any one time.
2Overvoltages at A, EN, IN, S, or D will be clamped by internal diodes. Current
should be limited to the maximum ratings given.
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADG786/ADG788 features proprietary ESD protection circuitry, permanent damage may
occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions
are recommended to avoid performance degradation or loss of functionality.
WARNING!
ESD SENSITIVE DEVICE
Model
ADG786BCP
ADG788BCP
ORDERING GUIDE
Temperature Range
–40°C to +85°C
–40°C to +85°C
Package Description
Chip Scale Package (CSP)
Chip Scale Package (CSP)
PIN CONFIGURATIONS
S2A 1
S3B 2
D3 3
S3A 4
EN 5
20 19 18 17 16
PIN 1
IDENTIFIER
ADG786
TOP VIEW
(Not to Scale)
15 D2
14 NC
13 D1
12 S1B
11 S1A
6 7 8 9 10
D1 1
S1B 2
VSS 3
GND 4
S2B 5
20 19 18 17 16
PIN 1
IDENTIFIER
ADG788
TOP VIEW
(Not to Scale)
15 S4B
14 VDD
13 S3B
12 D3
11 S3A
6 7 8 9 10
NC = NO CONNECT
EXPOSED PAD TIED TO SUBSTRATE, VSS
Package Option
CP-20
CP-20
REV. 0
–5–

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