1N5807, 1N5809 and 1N5811
GRAPHS (continued)
Pad Area per Pad (sq in)
FIGURE 3
Thermal Resistance vs FR4 Pad Area At Ambient
PCB horizontal (for each pad) with 1, 2, and 3 oz copper
T4-LDS-0168, Rev. 3 (120776)
VF (V)
FIGURE 4
Forward Voltage vs Forward Current
©2012 Microsemi Corporation
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