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ESDALC6-4N4

ESD array with low capacitance

STMicroelectronics 

Recommendation on PCB assembly

4

Recommendation on PCB assembly

ESDALC6-4N4

4.1

Stencil opening design

Reference design

● Stencil opening thickness: 100 µm

● Stencil opening for leads: Opening to footprint ratio is 100%.

Figure 17. Recommended stencil window position

T=100 µm and opening

ratio is 100%

180 µm

580 µm

Footprint

Stencil window

Footprint

4.2

Solder paste

1. Halide-free flux qualification ROL0 according to ANSI/J-STD-004.

2. “No clean” solder paste is recommended.

3. Offers a high tack force to resist component movement during high speed.

4. Solder paste with fine particles: powder particle size is 20-45 µm.

4.3

Placement

1. Manual positioning is not recommended.

2. It is recommended to use the lead recognition capabilities of the placement system, not

the outline centering.

3. Standard tolerance of ± 0.05 mm is recommended.

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Doc ID 022191 Rev 2

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