RT9259A Ver la hoja de datos (PDF) - Richtek Technology
Número de pieza
componentes Descripción
Lista de partido
RT9259A Datasheet PDF : 14 Pages
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RT9259A
Parameter
Reference Voltage
PWM Error Amplifier Reference
Linear Driver Reference
VREF Buffer Source Current
Error Amplifier
DC Gain
Gain-Bandwidth Product
Slew Rate
Gate Driver
Upper Drive Source
Upper Drive Sink
Lower Drive Source
Lower Drive Sink
Protection
Under Voltage Protection
Soft-Start Time Interval
Over Current Threshold
RT_DIS Shutdown Threshold
Linear Regulator
Output High Voltage
Output Low Voltage
Source Current
Sink Current
Symbol
VREF1
VREF2
GBW
SR
RUGATE
RUGATE
RLGATE
RLGATE
VUVP
TSS
VDRV
VDRV
IDRVSR
IDRVSC
Test Conditions
CLOAD = 5pF
VBOOT − VPHASE = 12V,
VBOOT − VUGATE = 1V
VUGATE = 1V
VCC – VLGATE = 1V
VLGATE = 1V
ROCSET = 20kΩ
Min Typ Max Units
0.792 0.8 0.808 V
0.784 0.8 0.816 V
5
--
--
mA
70 88
--
dB
6
15
-- MHz
3
6
-- V/us
--
4
8
Ω
--
4
8
Ω
--
4
6
Ω
--
2
4
Ω
0.36 0.4 0.45 V
2
3
4
ms
-- −400 --
mV
0.35 0.4
--
V
9.5 10.3 --
V
--
0.1
1
V
2
--
--
mA
0.5
--
--
mA
Note 1. Stresses listed as the above "Absolute Maximum Ratings" may cause permanent damage to the device. These are for
stress ratings. Functional operation of the device at these or any other conditions beyond those indicated in the
operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended
periods may remain possibility to affect device reliability.
Note 2. The device is not guaranteed to function outside its operating conditions.
Note 3. θJA is measured in the natural convection at TA = 25°C on a low effective thermal conductivity test board of
JEDEC 51-3 thermal measurement standard.
Note 4. θJA is measured in the natural convection at TA = 25°C on a high effective 4-layers 2S2P thermal conductivity test board
of JEDEC 51-7 thermal measurement standard.
www.richtek.com
6
DS9259A-02 March 2007
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