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AFBR-5803Z

FDDI, 100 Mb/s ATM, and Fast Ethernet Transceivers in Low-Cost 1 × 9 Package Style

Broadcom Corporation 

AFBR-5803Z/5803TZ/5803AZ/5803ATZ

Data Sheet

Transmitter Sections

The transmitter section of the AFBR-5803Z and AFBR-5805Z

series usee 1300-nm surface-emitting InGaAsP LEDs. These

LEDs are packaged in the optical subassembly portion of the

transmitter section. They are driven by a custom silicon IC,

which converts differential PECL logic signals, ECL referenced

(shifted) to a +3.3V or +5V supply, into an analog LED drive

current.

Receiver Sections

The receiver sections of the AFBR-5803Z and AFBR-5805Z

series use InGaAs PIN photodiodes coupled to a custom silicon

transimpedance preamplifier IC. These are packaged in the

optical subassembly portion of the receiver.

These PIN/preamplifier combinations are coupled to a custom

quantizer IC that provides the final pulse shaping for the logic

output and the Signal Detect function. The data output is

differential. The signal detect output is single-ended. Both data

and signal detect outputs are PECL compatible, ECL referenced

(shifted) to a +3.3V or +5V power supply.

Package

The overall package concept for the Broadcom transceivers

consists of the following basic elements: two optical

subassemblies, an electrical subassembly, and the housing as

illustrated in Figure 1 and Figure 2.

The package outline drawings and pin out are shown in

Figure 3, Figure 4, and Figure 5. The details of this package

outline and pin out are compliant with the multi-source

definition of the 1 × 9 SIP. The low profile of the Broadcom

transceiver design complies with the maximum height allowed

for the duplex SC connector over the entire length of the

package.

The optical subassemblies use a high-volume assembly

process together with low-cost lens elements that result in a

cost effective building block.

The electrical subassembly consists of a high-volume

multilayer printed circuit board on which the IC chips and

various surface-mounted passive circuit elements are attached.

The package includes internal shields for the electrical and

optical subassemblies to ensure low EMI emissions and high

immunity to external EMI fields.

The outer housing including the duplex SC connector

receptacle or the duplex ST ports is molded of filled

nonconductive plastic to provide mechanical strength and

electrical isolation. The solder posts of the Broadcom design

are isolated from the circuit design of the transceiver and do

not require connection to a ground plane on the circuit board.

The transceiver is attached to a printed circuit board with the

nine signal pins and the two solder posts that exit the bottom

of the housing. The two solder posts provide the primary

mechanical strength to withstand the loads imposed on the

transceiver by mating with duplex or simplex SC or ST

connectored fiber cables.

Figure 1 SC Connector Block Diagram

DIFFERENTIAL

DATA OUT

SINGLE-ENDED

SIGNAL

DETECT OUT

ELECTRICAL SUBASSEMBLY

QUANTIZER IC

PREAMP IC

DUPLEX SC

RECEPTACLE

PIN PHOTODIODE

OPTICAL

SUBASSEMBLIES

DIFFERENTIAL

LED

DATA IN

DRIVER IC

TOP VIEW

Broadcom

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