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NCV8660C Ver la hoja de datos (PDF) - ON Semiconductor

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NCV8660C Datasheet PDF : 11 Pages
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NCV8660C
ABSOLUTE MAXIMUM RATINGS
Rating
Symbol
Min
Max
Unit
Input Voltage (IN)
VIN
−0.3
40
V
Input Current
Output Voltage (OUT)
DC
Transient, t < 10 s (Note 1)
IIN
VOUT
−1.0
−0.3
−0.3
mA
V
5.5
16
Output Current (OUT)
IOUT
−1.0
Current
mA
Limited
Storage Temperature Range
DT (Reset Delay Time Select) Voltage (Note 2)
DT (Reset Delay Time Select) Current (Note 2)
RO (Reset Output) Voltage
DC
Transient, t < 10 s
TSTG
VDT
IDT
VRO
−55
−0.3
−1.0
−0.3
−0.3
150
°C
16
V
1.0
mA
V
5.5
16
RO (Reset Output) Current
ESD CAPABILITY
IRO
−1.0
1.0
mA
ESD Capability, Human Body Model (Note 3)
ESD Capability, Machine Model (Note 3)
THERMAL RESISTANCE
ESDHB
ESDMM
−2.0
−200
2.0
kV
200
V
Junction−to−Ambient (Note 4)
Junction−to−Lead (pin 6) (Note 4)
LEAD SOLDERING TEMPERATURE AND MSL
SOIC−8 FUSED
SOIC−8 FUSED
RqJA
RqJT
96
°C/W
33
°C/W
Moisture Sensitivity Level
SOIC−8 FUSED
MSL
3
Lead Temperature Soldering: SMD style only, Reflow (Note 5)
Pb−Free Part 60 − 150 sec above 217°C, 40 sec max at peak
SLD
265 peak
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. The output voltage must not exceed the input voltage.
2. External resistor required to minimize current to less than 1 mA when the control voltage is above 16 V.
3. This device series incorporates ESD protection and is tested by the following methods:
ESD HBM tested per AEC−Q100−002 (JS−001−2012)
ESD MM tested per AEC−Q100−003 (EIA/JESD22−A115)
4. Values represented typical steady−state thermal performance on 1 oz. copper FR4 PCB with 1 in2 copper area.
5. Per IPC / JEDEC J−STD−020C.
OPERATING RANGE
Pin Symbol, Parameter
Symbol
Min
Max
Unit
VIN, Input Voltage Operating Range
VIN
4.5
40
V
Junction Temperature Range
TJ
−40
150
°C
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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