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USB3300-EZK-TR

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface

SMSC -> Microchip 

Hi-Speed USB Host, Device or OTG PHY with ULPI Low Pin Interface

Datasheet

Chapter 4 Operational Description

Table 4.1 Maximum Guaranteed Ratings

PARAMETER

SYMBOL

CONDITIONS

MIN

Maximum VBUS, ID,

VMAX_5V

-0.5

EXTVBUS, DP, and DM

voltage to GND

Maximum VDD1.8 and

VMAX_1.8V

-0.5

VDDA1.8 voltage to

Ground

Maximum 3.3V supply

VMAX_3.3V

-0.5

voltage to Ground

Maximum I/O voltage to VMAX_IN

-0.5

Ground

Operating Temperature TMAX_OP

-40

Storage Temperature

TMAX_STG

-55

ESD PERFORMANCE

All Pins

VHBM

Human Body Model

±8

LATCH-UP PERFORMANCE

All Pins

ILTCH_UP

EIA/JESD 78, Class II

150

TYP

MAX

+5.5

2.5

4.0

4.0

85

150

UNITS

V

V

V

V

°C

°C

kV

mA

Note: Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent

damage to the device. Exposure to absolute maximum rating conditions for extended periods

may affect device reliability.

PARAMETER

VDD3.3 to GND

Input Voltage on Digital

Pins

Voltage on Analog I/O

Pins (DP, DM, ID)

VBUS to GND

Ambient Temperature

Table 4.2 Recommended Operating Conditions

SYMBOL

VDD3.3

VI

CONDITIONS

MIN

TYP

3.0

3.3

0.0

VI(I/O)

0.0

VVBUS

0.0

TA

-40

MAX

3.6

VDD3.3

UNITS

V

V

VDD3.3

V

5.25

85

C

Revision 1.08 (11-07-07)

14

DATASHEET

SMSC USB3300

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