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ISL6521 Ver la hoja de datos (PDF) - Renesas Electronics

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Lista de partido
ISL6521 Datasheet PDF : 14 Pages
First Prev 11 12 13 14
ISL6521
Small Outline Plastic Packages (SOIC)
N
INDEX
AREA
H
E
-B-
0.25(0.010) M B M
123
-A-
D
SEATING PLANE
A
L
h x 45o
-C-
µ
e
A1
C
B
0.10(0.004)
0.25(0.010) M C A M B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section
2.2 of Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate
burrs. Mold flash, protrusion and gate burrs shall not exceed
0.15mm (0.006 inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. In-
terlead flash and protrusions shall not exceed 0.25mm (0.010
inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual
index feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater
above the seating plane, shall not exceed a maximum value of
0.61mm (0.024 inch)
10. Controlling dimension: MILLIMETER. Converted inch dimen-
sions are not necessarily exact.
M16.15 (JEDEC MS-012-AC ISSUE C)
16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE
INCHES
MILLIMETERS
SYMBOL
A
A1
B
C
D
E
e
H
h
L
N
MIN
MAX
0.053
0.069
0.004
0.010
0.014
0.019
0.007
0.010
0.386
0.394
0.150
0.157
0.050 BSC
0.228
0.244
0.010
0.020
0.016
0.050
16
0o
8o
MIN
MAX NOTES
1.35
1.75
-
0.10
0.25
-
0.35
0.49
9
0.19
0.25
-
9.80
10.00
3
3.80
4.00
4
1.27 BSC
-
5.80
6.20
-
0.25
0.50
5
0.40
1.27
6
16
7
0o
8o
-
Rev. 1 02/02
FN9148 Rev 2.00
Feb 8, 2005
Page 14 of 14

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