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Número de pieza(s) : HCT802 HCT802TX HCT802TXV
Optek Technology
componentes Descripción : Dual Enhance ment Mode MOSFET
Número de pieza(s) : BLF8G22LS-200V BLF8G22LS-200GV
NXP Semiconductors.
componentes Descripción : Power LDMOS transistor
Número de pieza(s) : BLF8G20LS-200V
Ampleon
componentes Descripción : Power LDMOS transistor
Número de pieza(s) : FM3100-AL FM3150-AL FM320-AL FM3200-AL FM330-AL FM340-AL FM350-AL FM360-AL FM380-AL FM3100-L
Formosa Technology
componentes Descripción : Chip Schottky Barrier Rectifier
Número de pieza(s) : BLF8G22LS-200V BLF8G22LS-200GV
Ampleon
componentes Descripción : Power LDMOS transistor
Número de pieza(s) : BLF8G20LS-200V
NXP Semiconductors.
componentes Descripción : Power LDMOS transistor
Número de pieza(s) : T2322B T2322BG
Littelfuse, Inc
componentes Descripción : Thyristors SURFACE MOUNT – 200V
Número de pieza(s) : GS88237BB-250V GS88237BB-200V GS88237BB-250IV GS88237BB-200IV GS88237BD-250V GS88237BD-200V GS88237BD-250IV GS88237BD-200IV GS88237BGB-250V GS88237BGB-200V
Giga Semiconductor
componentes Descripción : 256K x 36 9Mb SCD/DCD Sync Burst SRAM
Número de pieza(s) : GS88118B-XXXV GS88118BD-150IV GS88118BD-150V GS88118BD-200IV GS88118BD-200V GS88118BD-250IV GS88118BD-250V GS88118BD-XXXV GS88118BGD-150IV GS88118BGD-150V
Giga Semiconductor
componentes Descripción : 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
Número de pieza(s) : BUX51SMD
Semelab - > TT Electronics plc
componentes Descripción : Bipolar NPN Device in a Hermetically sealed Ceramic SURFACE MOUNT Package for High Reliability Applications
Número de pieza(s) : GS881E18BD-150IV GS881E18BD-150V GS881E18BD-200IV GS881E18BD-200V GS881E18BD-250IV GS881E18BD-250V GS881E18BGD-150IV GS881E18BGD-150V GS881E18BGD-200IV GS881E18BGD-200V
Giga Semiconductor
componentes Descripción : 512K x 18, 256K x 32, 256K x 36 9Mb Sync Burst SRAMs
Número de pieza(s) : MB110S-PJ MB18S-PJ MB16S-PJ MB14S-PJ MB120S-PJ MB115S-PJ
Dongguan Pingjingsemi Technology Co., Ltd,
componentes Descripción : SURFACE MOUNT SCHOTTKY BRIDGE RECTIFIERS
Número de pieza(s) : BUX51SMD05
Semelab - > TT Electronics plc
componentes Descripción : Bipolar NPN Device in a Hermetically sealed Ceramic SURFACE MOUNT Package for High Reliability Applications
Número de pieza(s) : 2N5666SMD
Semelab - > TT Electronics plc
componentes Descripción : Bipolar NPN Device in a Hermetically sealed Ceramic SURFACE MOUNT Package for High Reliability Applications
Número de pieza(s) : 2N5666SMD05
Semelab - > TT Electronics plc
componentes Descripción : Bipolar NPN Device in a Hermetically sealed Ceramic SURFACE MOUNT Package for High Reliability Applications
Número de pieza(s) : 2N5052SMD
Semelab - > TT Electronics plc
componentes Descripción : Bipolar NPN Device in a Hermetically sealed Ceramic SURFACE MOUNT Package for High Reliability Applications
Número de pieza(s) : GS880Z18BGT-150V GS880Z18BGT-200V GS880Z18BGT-250V GS880Z18BT-150IV GS880Z18BT-150V GS880Z18BT-200IV GS880Z18BT-200V GS880Z18BT-250IV GS880Z18BT-250V GS880Z32BGT-150V
Giga Semiconductor
componentes Descripción : 9Mb Pipelined and Flow Through Synchronous NBT SRAM
Número de pieza(s) : GS882Z18BGD-150IV GS882Z18BGD-150V GS882Z18BGD-200IV GS882Z18BGD-250IV GS882Z36BB-200V GS882Z36BGD-150IV GS882Z36BGD-150V GS882Z36BGD-200IV GS882Z36BGD-200V GS882Z36BGD-250IV
Giga Semiconductor
componentes Descripción : 9Mb Pipelined and Flow Through Synchronous NBT SRAM
Número de pieza(s) : IRFN9240SMD
Semelab - > TT Electronics plc
componentes Descripción : P–CHANNEL POWER MOSFET
Número de pieza(s) : MMBT3906LP MMBT3906LP-7 MMBT3906LP-7B
Diodes Incorporated.
componentes Descripción : 40V PNP SMALL SIGNAL SURFACE MOUNT TRANSISTOR (Rev - 2011)