FEATURES
● PROPRIETARY SOFT GLASS JUNCTION
   PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
   MECHANICAL STRENGTH AND HEAT DISSIPATION
   (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
● LOW FORWARD VOLTAGE DROP
● 3A at TA = 75 °C WITH NO THERMAL RUNAWAY