FEATURES
• Superectifier structure for high reliability application
• Cavity-free glass-passivated junction
• Low forward voltage drop
• Low leakage current, IR less than 0.1 µA
• High forward surge capability
• Meets environmental standard MIL-S-19500
• Solder dip 260 °C, 40 s
• Component in accordance to RoHS 2002/95/EC and WEEE 2002/96/EC

TYPICAL APPLICATIONS
    For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes application.