56-G6005-001 - Dallas Semiconductor -> Maxim Integrated Hoja de datos - DataSheetBank

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56-G6005-001 Hoja de datos - Dallas Semiconductor -> Maxim Integrated

56-G6005-001 image

Número de pieza

56-G6005-001

componentes Descripción

MARKETING OUTLINE - 16L CHIP SCALE BGA (4X4) 1.0MM PITCH, 1.41 THICK, 2 LAYER

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Dallas Semiconductor -> Maxim Integrated

Dallas

MARKETING OUTLINE - 16L CHIP SCALE BGA (4X4) 1.0MM PITCH, 1.41 THICK, 2 LAYER

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Número de pieza

componentes Descripción

PDF

Fabricante

MARKETING OUTLINE - .300" SOIC 32 LEAD .050" PITCH

Dallas Semiconductor -> Maxim Integrated

PACKAGE OUTLINE 12, 16L THIN QFN, 3x3x0.8mm

Maxim Integrated

PACKAGE OUTLINE, 8L, 14L,16L, SOIC .150 INCH

Maxim Integrated

1.0mm pitch/Disconnectable Crimp style connectors

Unspecified

Marketing Information

Unspecified

Marketing Information

eupec GmbH

Marketing Information

eupec GmbH

APBA3010SRSGWPR

3.0 x 1.0mm SMD CHIP LED LAMP

Kingbright

Voltage Detectors in 4-Bump (2 x 2) Chip-Scale Package

Maxim Integrated

K5L5563CAA-D770

Memory 256M ( 16M x 16) MCP - 84 BGA Type ( 8mmx 11.6mmx 1.0mm )

Samsung

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