DESCRIPTION
The Accutek AK584096 high density memory module is CMOS DRAM organized in 4 Meg x 8 bit words. The assembly consists of eight standard 4 Meg x 1 DRAMs in plastic SOJ packages mounted on the front side of a printed circuit board. The module can be configured as a leadless 30 pad SIM or a leaded 30 pin SIP. The module is only 0.800 inch high (same height as a standard 1 Meg module) making it ideally suited for applications with low height restrictions. MICROCIRCUIT CORPORATION

FEATURES
• 4,194,304 x 8 bit organization
• Optional 30 Pad leadless SIM (Single In-Line Module) or 30
   Pin leaded SIP (Single In-Line Package)
• JEDEC standard pinout
• Each device has common D and Q lines with common RAS,
   CAS and WE control
• CAS-before-RAS refresh
• Power
   4.40 Watt Max Active (80 nSEC)
   3.75 Watt Max Active (100 nSEC)
   44 mW Max Standby
• Operating free air temperature 0°C to 70°C
• Upward compatible with AK5816384
• Downward compatible with AK58256 and AK581024