A New High Power IC Surface Mount Package Family: PowerSO-20™
& PowerSO-36 Power IC Packaging from Insertion to Surface Mounting

A new, high power IC surface mount package family is introduced in this note. It is called PowerSO family and has the Jedec registration MO-166.
STMicroelectronics developed PowerSO in order to answer the increasing demand of miniaturization and quality in power applications. Automotive, industrial, audio and telecom markets will take advantage of the new package, by introducing the use of Surface Mount Technology in the production of power systems.