PRODUCT DESCRIPTION
   The AWT6301 meets the increasing demands for higher efficiency and linearity in CDMA1X handsets, while reducing pcb area by 44%. The package pinout was chosen to enable handset manufacturers to switch from a 4mm x 4mm PA module with very few layout changes to the phone board. The device is manufactured on an advanced InGaP HBT MMIC technology offering state-of-the-art reliability, temperature stability, and ruggedness.

FEATURES
• InGaP HBT Technology
• High Efficiency: 53%, AMPS, 39% CDMA
• Low Quiescent Current: 50 mA
• Low Leakage Current in Shutdown Mode: <1 µA
• VREF = +2.85 V (+2.7 V Min Over Temp.)
• Optimized for a 50 Ω System
• Low Profile Surface Mount Package: 1.1mm
• CDMA 1XRTT, 1xEV-DO Compliant
• Pinout Enables Easy Phone Board Migration
   From 4 mm x 4 mm Package

APPLICATIONS
• Single Mode CDMA Wireless Handsets
• Dual Mode AMPS/CDMA Wireless Handsets