B140LW Hoja de datos - Chip Integration Technology Corporation
Número de pieza
B140LW
componentes Descripción
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3 Pages
File Size
51.3 kB
Fabricante
Chip Integration Technology Corporation
■ Features
• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.B120LWG.
• Lead-free parts meet environmental standards of MIL-STD-19500 /228
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