B260W-S Hoja de datos - Chip Integration Technology Corporation
Número de pieza
B260W-S
componentes Descripción
Other PDF
no available.
PDF
page
3 Pages
File Size
53.2 kB
Fabricante
Chip Integration Technology Corporation
Features
• Low profile surface mounted application in order to optimize board space.
• Low power loss, high efficiency.
• High current capability, low forward voltage drop.
• Ultra high-speed switching.
• Silicon epitaxial planar chip, metal silicon junction.
• Suffix "G" indicates Halogen-free part, ex.B220WG-S.
• Lead-free parts meet environmental standards of MIL-STD-19500 /228
Número de pieza
componentes Descripción
PDF
Fabricante
2A Surface Mount Schottky Barrier Rectifiers
( Rev : 2012 )
Chip Integration Technology Corporation
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