FEATURES
● PROPRIETARY SOFT GLASS® JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● Large die for high power capability
● Very low forward voltage drop
● Built-in stress relief mechanism for die protection
● Silver plated substrates for easy soldering or installation
● Soldering temperature: 250 °C maximum
● Protects expensive automotive electronics and mobile
equipment