BAR3508 Hoja de datos - DIOTEC Electronics Corporation
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BAR3508
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DIOTEC Electronics Corporation
FEATURES
● PROPRIETARY SOFT GLASS JUNCTION PASSIVATION FOR SUPERIOR RELIABILITY AND PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● Soldering Temperature: 250 °C maximum
● Mounting Position: Any
● Polarity: Color band denotes cathode
● Weight: 0.6 Ounces (1.8 Grams)
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