FEATURES
● PROPRIETARY SOFT GLASS® JUNCTION
   PASSIVATION FOR SUPERIOR RELIABILITY AND
   PERFORMANCE
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM 
   MECHANICAL STRENGTH AND HEAT DISSIPATION
   (Solder Voids: Typical ≤ 2%, Max. ≤10% of Die Area)
● Large die for high power capability
● Very low forward voltage drop
● Built-in stress relief mechanism for die protection
● Silver plated substrates for easy soldering or installation
● Soldering temperature: 250 °C maximum
● Protects expensive automotive electronics and mobile
   equipment