BAV19WS-SOD323(V2) Hoja de datos - DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD
Número de pieza
BAV19WS-SOD323
componentes Descripción
Other PDF
PDF
page
3 Pages
File Size
372.2 kB
Fabricante
DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD
FEATURES
✦ For surface mounted applications
✦ Glass Passivated Chip Junction
✦ Fast reverse recovery time
✦ Ideal for automated placement
✦ Lead free in comply with EU RoHS 2011/65/EU directives
MECHANICAL DATA
✦ Case: SOD-323
✦ Terminals: Solderable per MIL-STD-750, Method 2026
✦ Approx. Weight: 4.5mg / 0.00016oz
Número de pieza
componentes Descripción
PDF
Fabricante
For surface mounted applications ( Rev : V2 )
DONGGUAN YOU FENG WEI ELECTRONICS CO., LTD
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