BYG10D Hoja de datos - Shenzhen Luguang Electronic Technology Co., Ltd
Número de pieza
BYG10D
componentes Descripción
Other PDF
no available.
PDF
page
4 Pages
File Size
592 kB
Fabricante
Shenzhen Luguang Electronic Technology Co., Ltd
FEATURES
◇ Low profile package
◇ Ideal for automated placement
◇ Controlled avalanche characteristics
◇ Glass passivated junction
◇ Low reverse current
◇ High surge current capability
◇ Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C
◇ Solder dip 260 °C, 40 s
◇ Compliant to RoHS directive 2002/95/EC and in accordance to WEEE 2002/96/EC
Número de pieza
componentes Descripción
PDF
Fabricante
Low profile package Ideal for automated placement
Shanghai Leiditech Electronic Technology Co., Ltd
miniature low profile Surface Mount package clock oscillator
Advanced Crystal Technology
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