BYM26DGP Hoja de datos - Gulf Semiconductor
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BYM26DGP
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2 Pages
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70.2 kB
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Gulf Semiconductor
FEATURE
High temperature metallurgically bonded construction
Sintered glass cavity free junction
Capability of meeting environmental standard of MIL-S-19500
High temperature soldering guaranteed
350°C /10sec/0.375”lead length at 5 lbs tension
Low leakage current Typical Ir<0.1µA
Excellent stability
Guaranteed avalanche energy absorption capability
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