CHIPSESD DEVICES

Littelfuse’s ChipSESD family of Silicon ESD devices, available in EIA-0201 and EIA-0402 sized rectangular SMT passive component packages, can help protect electronic circuits against damage from electrostatic discharge (ESD) events.
The SESD0201P1BN-0400-090, 0201-sized ChipSESD device’s miniature footprint (0.6mm x 0.3mm x 0.3mm) is approximately 70% smaller than prior-generation devices. This offers designers flexibility in space constrained applications.

FEATURES
• Input capacitance -4.0pF (typ) & 4.5pF (typ)
• Low leakage current – 1.0μA (max)
• Low working reverse voltage - 6.0V (max)
• Capable of withstanding numerous ESD strikes
• RoHS compliant
• Halogen free
   (refers to: Br≥900ppm, Cl≥900ppm, Br+Cl≥1500ppm)

BenefitS
• Silicon ESD devices in an EIA-0201 and EIA-0402
   sized rectangular SMT passive component package
• Bi-directional operation eliminates orientation
   constraints
• Standard PCB assembly and rework process
• ESD protection in space-constrained portable
   electronics and mobile handsets
• Helps protect electronic circuits against damage
   from ESD
• Assists equipment to pass IEC61000-4-2, level 4 testing

APPLICATIONS
• Mobile phones and portable electronics
• Digital cameras and camcorders
• Notebooks, set top boxes, motherboards
• USB 2.0 and computer I/O ports
• Applications requiring high ESD performance in a
   small package