The CP336V-2N5551 is a silicon NPN transistor designed for high voltage, general purpose applications.
MECHANICAL SPECIFICATIONS:
Die Size 17.3 x 17.3 MILS
Die Thickness 7.1 MILS
Base Bonding Pad Size 3.9 x 3.9 MILS
Emitter Bonding Pad Size 3.9 x 3.9 MILS
Top Side Metalization Al-Si – 17,000Å
Back Side Metalization Au – 9,000Å
Scribe Alley Width 1.8 MILS
Wafer Diameter 5 INCHES
Gross Die Per Wafer 57,735