CSP12S120S Hoja de datos - Chip Integration Technology Corporation
Número de pieza
CSP12S120S
componentes Descripción
Other PDF
no available.
PDF
page
3 Pages
File Size
434.8 kB
Fabricante
Chip Integration Technology Corporation
■ Features
• Low forward voltage drop.
• Excellent high temperature stability.
• Fast switching capability.
• Suffix "G" indicates Halogen-free part, ex.CSP12S120SG.
• Lead-free parts meet environmental standards of
MIL-STD-19500 /228
■ Mechanical data
• Epoxy : UL94-V0 rated flame retardant.
• Case : Molded plastic, TO-277.
• Lead : Solder plated, solderable per MIL-STD-750,
Method 2026.
• Polarity: Indicated by cathode band.
• Mounting Position : Any.
• Weight : Approximated 0.093 grams.
Número de pieza
componentes Descripción
PDF
Fabricante
15A Surface Mount Trench Super Low Barrier Diode
Chip Integration Technology Corporation
Surface Mount Low Barrier Schottky Diode ( Rev : V2 )
M/A-COM Technology Solutions, Inc.
Share Link: