DB1504 Hoja de datos - DIOTEC Electronics Corporation
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DB1504
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DIOTEC Electronics Corporation
FEATURES
● VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM MECHANICAL STRENGTH AND HEAT DISSIPATION (Solder Voids: Typical < 2%, Max. < 10% of Die Area)
● BUILT-IN STRESS RELIEF MECHANISM FOR SUPERIOR RELIABILITY AND PERFORMANCE
● ELECTRICALLY ISOLATED METAL CASE FOR MAXIMUM HEAT DISSIPATION
● UL RECOGNIZED - FILE #E124962
● RoHS COMPLIANT
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